Jiangsu Aisen Semiconductor Co., Ltd. (688720)

Overview

Jiangsu Aisen Semiconductor Material Co.,Ltd. specializes in the research, development, manufacture, and sale of high-end electronic chemicals, essential for semiconductor manufacturing. Founded in 2010 and headquartered in Kunshan, China, the company has established itself as a key player in the supply of materials for various semiconductor application areas, including wafer/advanced packaging, TFT-LCD/AMOLED displays, assembly applications, and more.

Products and Services

Jiangsu Aisen Semiconductor Material Co.,Ltd. offers a wide range of products tailored to meet the rigorous demands of the semiconductor industry:

• Wafer/Advanced Packaging Materials:
  • Positive and Negative Photoresist: Specially formulated materials that change properties when exposed to light, used in the patterning process of semiconductor manufacturing.
  • Developer: A solution used to develop the exposed photoresist, revealing the semiconductor pattern.
  • Cu etchant GCT ECU 312: An etching chemical designed for the removal of copper, a critical step in the production of semiconductor devices.
  • Positive and Negative Stripper GCT STN 1900: A chemical solution used to strip photoresist from the wafer after patterning is complete.
  • AL cleaner GCT AC 6680: A cleaning solution designed for aluminum surfaces, ensuring contamination-free substrates in semiconductor manufacturing.
• TFT-LCD/AMOLED Materials:
  • OLED Positive Photoresist: A photoresist specifically designed for use in the manufacture of OLED displays, crucial for creating precise and intricate display patterns.
  • Stripper: A solvent used to remove photoresist in the fabrication of TFT-LCD and AMOLED displays, ensuring clarity and performance of the displays.
  • Ag etchant: A chemical used for the etching of silver, necessary for creating conductive pathways in TFT-LCD and AMOLED displays.
• Assembly Materials:
  • Plating Products: Chemicals used for the deposition of metal layers on semiconductor devices, essential for creating electrical connections within the device.
  • UV Tapes: Ultraviolet-sensitive tapes used to protect wafer surfaces during slicing and dicing operations.
  • Wafer Dicing Solution: A solution used to facilitate the cutting of wafers into individual semiconductor chips without causing damage.
  • Flux Cleaner: A cleaning agent used to remove flux residues after soldering, ensuring high-quality assembly of semiconductor devices.
• FPC/HDI Series Applications:
  • Bi-component Photo Sensitive Solder Resist Ink: A two-part ink used in the protective coating of circuit boards, essential for preventing solder bridges and ensuring circuit integrity.
  • Thermal Curing Alkaline Strip Ink: An ink that cures with heat and is removable with an alkaline solution, used for creating temporary protective layers during circuit board manufacturing.
  • Copper Filling Plating Additive Series Products: Additives used in the copper plating process to ensure smooth, uniform copper fill in circuit board vias, critical for the reliability and performance of the device.