Trans-Sun Materials Technology Co., Ltd. (6967)

Overview

Shinko Electric Industries Co., Ltd., established in 1946 and headquartered in Nagano, Japan, specializes in the development, production, and sales of a diverse range of semiconductor packages. The company serves a wide spectrum of industries including computer and networking, mobile, industrial and IoT, and automotive, reinforcing its presence in the technology sector. As a subsidiary of the industry giant Fujitsu Limited, Shinko Electric Industries leverages extensive research and development capabilities to innovate and meet the evolving demands of its global client base.

Products and Services

• Plastic Laminated Packages and Leadframes: Essential components in electronic devices, offering protection and connectivity for semiconductor chips.
• Glass-to-Metal Seals: Used to ensure the reliability of semiconductor components by providing hermetic seals, crucial for the longevity of sensitive electronics.
• Heat Spreaders and Arresters: Critical for managing the thermal performance and protecting electronic devices from voltage spikes, respectively.
• Ceramic Electrostatic Chuck Products: Facilitate the handling of wafers during the semiconductor manufacturing process through electrostatic attraction.
• IC Packages and System Modules Assembly: Provide the structural support and connective pathways necessary for integrated circuits to function within electronic systems.
• Substrates: Including flip-chip package, plastic-BGA, coreless, and 2.3D package substrates, these form the physical platform on which semiconductor devices are built.
• Metal Products: Supply various essential components used in the construction of semiconductor devices and systems.
• Molded Core Embedded Package: A compact, thin packaging solution integrating IC chips with active/passive components, designed for small-sized electronic devices and various modules.
• Bare Die Flip-Chip Packages: Enable direct electrical connection of face-down (flipped) semiconductor chips onto substrates or circuit boards, enhancing performance.
• Molded Underfill Flip-Chip Packages: Provide enhanced reliability for flip-chip assemblies through the application of underfill materials.
• High-Heat-Dissipation Flip-Chip Packages: Designed to effectively manage the heat generated by high-performance semiconductor devices.
• Copper Pillars: Offer an advanced interconnect technology for flip-chip semiconductor packages, enabling finer pitch and higher performance.
• CAN Packages for High-Speed Optical Communication: Critical in the infrastructure of high-speed data communication, providing robust and reliable packaging solutions.