Poh Huat Resources Holdings Berhad logo

Poh Huat Resources Holdings Berhad (7088)

Market Closed
11 Aug, 07:45
XKLS XKLS
RM
0. 65
+0.01
+1.5625%
RM
- Market Cap
- P/E Ratio
72% Div Yield
10,000 Volume
- Eps
RM 0.64
Previous Close
Add Transaction
Day Range
0.64 0.65
Year Range
0.62 1
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Summary

7088 closed today higher at RM0.65, an increase of 1.5625% from yesterday's close, completing a monthly increase of 0% or RM0. Over the past 12 months, 7088 stock lost -28.1768%.
7088 pays dividends to its shareholders, with the most recent payment made on Dec 01, 2025. The next estimated payment will be in 2 months ago on Jun 01, 2026 for a total of RM31.
The last earnings report, released on Mar 16, 2026, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0.0037%, based on the last three reports.
Poh Huat Resources Holdings Berhad has completed 4 stock splits, with the recent split occurring on Oct 16, 2015.
The company's stock is traded on 2 different exchanges and in various currencies, with the primary listing on JPX (JPY).

7088 Chart

Poh Huat Resources Holdings Berhad (7088) FAQ

What is the stock price today?

The current price is RM0.65.

On which exchange is it traded?

Poh Huat Resources Holdings Berhad is listed on XKLS.

What is its stock symbol?

The ticker symbol is 7088.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 72%.

What is its market cap?

As of today, no market cap data is available.

Has Poh Huat Resources Holdings Berhad ever had a stock split?

Poh Huat Resources Holdings Berhad had 4 splits and the recent split was on Oct 16, 2015.

Poh Huat Resources Holdings Berhad Profile

Professional Services Industry
Industrials Sector
Mr. Tsutomu Sato CEO
XKLS Exchange
MYL7088OO007 ISIN
DE Country
4,588 Employees
29 Sep 2025 Last Dividend
29 Nov 2023 Last Split
- IPO Date

Overview

Forum Engineering Inc. is a prominent entity based in Tokyo, Japan, dedicated to providing specialized personnel management services. Since its inception in 1981, the company has been at the forefront of supporting the mechanical and electrical engineering sectors alongside the Information Technology (IT) domain. With a focus on optimizing the engineering workforce in Japan, Forum Engineering Inc. plays a pivotal role in engineering staffing, recruitment, career change facilitation, corporate training, and the innovative management of engineer talents through advanced cloud services.

Products and Services

  • Engineer Staffing Services:

    Specializing in mechanical, electrical, and IT engineering fields, Forum Engineering Inc. provides top-tier personnel to meet the varied demands of these dynamic sectors. This service ensures that companies receive highly qualified engineers tailored to their specific project needs.

  • Recruitment and Career Changing Services:

    Focused on assisting engineers in finding new opportunities and facilitating smooth career transitions, these services cater to both individuals seeking growth and companies looking for fresh talents.

  • Job Placement Services:

    Designed to match the right talent with the right employer, Forum Engineering’s job placement services streamline the hiring process, making it more efficient for both engineers and companies.

  • Corporate Training Services:

    These services aim at skill enhancement and professional development of engineers. With an emphasis on continuous learning, Forum Engineering Inc. ensures that the workforce stays updated with the latest technological advancements and methodologies.

  • Cognavi Talent Management:

    This innovative cloud service is a hallmark of Forum Engineering Inc.’s commitment to leveraging technology for talent management. By visualizing and integrating the management of skills among mechanical and electrical engineers, Cognavi optimizes employee placement, enhancing both performance and organizational efficiency.

Contact Information

Address: The Okura Prestige Tower, Tokyo, Japan, 105-0001
Phone: 81 3 3560 5505