BSL Corporation Bhd logo

BSL Corporation Bhd (7221)

Market Open
11 Aug, 02:15
XKLS XKLS
RM
0. 02
0
0%
RM
77.31M Market Cap
- P/E Ratio
0.05% Div Yield
2,200 Volume
- Eps
RM 0.02
Previous Close
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Day Range
0.02 0.02
Year Range
0.01 0.03
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Summary

7221 trading today higher at RM0.02, an increase of 0% from yesterday's close, completing a monthly increase of 33.3333% or RM0.01. Over the past 12 months, 7221 stock gained 0%.
7221 is not paying dividends to its shareholders.
The last earnings report, released on Oct 27, 2016, exceeded the consensus estimates by 0.0144%. On average, the company has surpassed earnings expectations by 0.004%, based on the last three reports.
BSL Corporation Bhd has completed 2 stock splits, with the recent split occurring on Feb 07, 2023.
The company's stock is traded on one exchange.

7221 Chart

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BSL Corporation Bhd (7221) FAQ

What is the stock price today?

The current price is RM0.02.

On which exchange is it traded?

BSL Corporation Bhd is listed on XKLS.

What is its stock symbol?

The ticker symbol is 7221.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.05%.

What is its market cap?

As of today, the market cap is 77.31M.

Has BSL Corporation Bhd ever had a stock split?

BSL Corporation Bhd had 2 splits and the recent split was on Feb 07, 2023.

BSL Corporation Bhd Profile

Metals & Mining Industry
Materials Sector
Mr. Boon Yin Chai CEO
XKLS Exchange
MYL7221OO004 ISIN
MY Country
671 Employees
11 Mar 2009 Last Dividend
5 Nov 2021 Last Split
- IPO Date

Overview

BSL Corporation Berhad, founded in 1978 and based in Kuala Lumpur, Malaysia, serves as an investment holding entity with diverse operations in the precision metal parts sector. The company's engagements span across stamping and manufacturing of precision metal parts, alongside tool and dies fabrication primarily within Malaysia. Its business activities are organized into various segments, including Investment Holding; Precision Stamping and Tooling; Printed Circuit Board and Module Assembly; and Others. BSL Corporation Berhad has established itself in the metal fabrication industry, offering a wide range of services and products that cater to the electronics and electrical sectors, as well as property development and trading activities. This multidimensional approach allows the company to offer integrated solutions, from metal stamping to final product assembly, serving a broad array of industrial requirements.

Products and Services

  • Fabrication and Forging of Base Metal Components:

    BSL Corporation Berhad specializes in the fabrication and forging of base metal components, utilizing cutting-edge technology and processes to meet high precision standards. This service is pivotal for industries where component durability and precision are critical.

  • Printed Circuit Board and Module Assembly Services:

    The company provides comprehensive solutions for printed circuit board (PCB) and module assembly, catering to the electronics industry's needs for efficient and reliable electronic components and devices. This includes the assembly of electronic and electrical components, systems, and devices, ensuring high-quality standards and operational reliability.

  • Property Development and Related Trading Activities:

    Expanding beyond its core manufacturing and technical services, BSL Corporation Berhad engages in property development and related trading activities, leveraging its industry experience and market insights to deliver value in the real estate market.

  • Metal Stamping, Sheet Metal, and CNC Machining:

    The company offers a vast range of manufacturing services, including metal stamping, sheet metal fabrication, and CNC machining. These services are designed to produce high-precision parts and components for a variety of industrial applications, supported by advanced technology and expert craftsmanship.

  • Semiconductor Foundry Equipment Manufacturing and Repair:

    BSL Corporation Berhad manufactures and repairs semiconductor foundry equipment, addressing the demand for specialized machinery in the semiconductor industry. This service underscores the company's commitment to supporting the technological advancements and operational efficiency of the semiconductor sector.

  • Additional Services:

    The company further offers welding, roll forming, final assembly, and various secondary process services. These additional capabilities complement its primary services, providing a comprehensive solution set from tool making to warehousing, logistics support, and beyond, to meet the diverse needs of its clientele.

Contact Information

Address: E-10-4, Megan Avenue 1 189, Kuala Lumpur, Malaysia, 50400
Phone: 60 2 181 0516