Suregiant Technology Co., Ltd. logo

Suregiant Technology Co., Ltd. (7669)

Market Closed
13 Aug, 05:30
TWSE TWSE
NT$
624. 00
+4
+0.6452%
NT$
- Market Cap
- P/E Ratio
- Div Yield
26,170 Volume
- Eps
NT$ 620
Previous Close
Add Transaction
Day Range
613 629
Year Range
167 1,035
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Summary

7669 closed today higher at NT$624, an increase of 0.6452% from yesterday's close, completing a monthly decrease of -14.5205% or -NT$106. Over the past 12 months, 7669 stock gained 41.4966%.
7669 is not paying dividends to its shareholders.
The stock of the company had never split.
The company's stock is traded on one exchange.

7669 Chart

Suregiant Technology Co., Ltd. (7669) FAQ

What is the stock price today?

The current price is NT$624.00.

On which exchange is it traded?

Suregiant Technology Co., Ltd. is listed on TWSE.

What is its stock symbol?

The ticker symbol is 7669.

Does it pay dividends? What is the current yield?

It does not pay dividends to its shareholders.

What is its market cap?

As of today, no market cap data is available.

Has Suregiant Technology Co., Ltd. ever had a stock split?

No, there has never been a stock split.

Suregiant Technology Co., Ltd. Profile

- Industry
- Sector
- CEO
TWSE Exchange
- ISIN
Taiwan Country
37 Employees
- Last Dividend
- Last Split
- IPO Date

Overview

Suregiant Technology Co., Ltd. is a company based in Taiwan that excels in precision molding and coating technologies specifically tailored for the semiconductor industry. Established in 2007, with its headquarters located in Taoyuan City, Suregiant manufactures and offers protective adhesive tape products that are essential for various semiconductor manufacturing processes. The company is primarily engaged in the wafer semiconductor packaging and testing sector, emphasizing the production of film consumables and actively collaborating with customers to create customized solutions. With a dedicated team of approximately 23 employees under the leadership of CEO Yun-Bin Yang, Suregiant Technology occupies a unique and vital position in providing specialized materials that enhance the efficiency of semiconductor production workflows, underlining its significant role in Taiwan's thriving semiconductor ecosystem.

Products and Services

  • Wafer Back-Side Grinding Tape: This product is designed to protect the delicate surfaces of wafers and solder balls during the grinding process. It plays a crucial role in ensuring that the integrity of the wafer is maintained, preventing damage that could lead to faults in subsequent manufacturing stages.
  • Release Films: Used in encapsulation procedures, these films are engineered to facilitate easy removal of encapsulate materials from substrates. They are critical in ensuring that processes such as molding do not lead to contamination or material adhesion issues, thereby ensuring product quality and reliability.

Contact Information

Address: No. 72, Nangong Road
Phone: 886 0 3222 9398