Hermes Testing Solutions Inc. (7856)

Overview

Hermes Testing Solutions Inc. is a Taiwan-based company that specializes in the development and manufacturing of advanced semiconductor testing and inspection equipment. Established in 2004 and headquartered in Hsinchu City, the company has emerged as a key player in providing comprehensive testing solutions within the semiconductor industry. With a focus on high-frequency and high-power wafer applications, Hermes Testing Solutions plays a pivotal role in sectors such as High-Performance Computing (HPC), 5G technology, Artificial Intelligence of Things (AIoT), and electric vehicles. The organization is committed to excellence in ensuring wafer quality through real-time defect detection and both 2D and 3D inspection, thereby enhancing efficiency across the global semiconductor supply chain.
Additionally, Hermes Testing Solutions employs approximately 361 skilled professionals and operates across several key markets, including the United States, Asia, Europe, China, and Japan. The company’s commitment to innovation and quality is underscored by its ISO 9001 and SEMI S2 certifications. Since its listing on the Emerging Stock Board in September 2025, Hermes Testing Solutions has continued to push the boundaries of semiconductor testing technology.

Products and Services

• Probe Cards for WAT: Specialized tools designed for Wafer Level Testing (WAT) to enhance testing accuracy and efficiency across a range of devices.
• Logic Testing Solutions: Comprehensive solutions tailored for logic devices, ensuring maximum reliability and performance in semiconductor testing.
• LCD Driver Testing: Designed specifically for the testing of liquid crystal display drivers, facilitating high-quality display performance.
• RF Device Testing: Advanced solutions for radio frequency devices, which require precise testing mechanisms due to their sensitivity and performance specifications.
• TF-MLC Testing Equipment: A state-of-the-art testing platform for triple-level cell (TLC) NAND flash memory, focusing on speed and accuracy.
• Customized Products: Offers tailored solutions such as Hprobe, providing bespoke tools to meet unique testing requirements.
• AOI Toolkit: Automated Optical Inspection toolkit designed to identify defects in semiconductor chips and enhance quality assurance processes.
• FIMS: Feature Inspection Measurement System that provides detailed analysis and feedback on semiconductor performance.
• TEMIC Mars X8/X8 Plus: Innovative testing devices that provide efficiency in analyzing semiconductor functionality.
• D-sensor Bridge Beam: Custom-built bridges that improve testing accuracy and support the integration of various testing technologies.
• EasyCool: A thermal management solution that enhances heat dissipation during testing, ensuring device stability.
• Laser Cleaners: Advanced cleaning technology employing laser precision to maintain the integrity and cleanliness of testing surfaces.
• In-House Services: Offers PI/SI simulation, thermal simulation, and flying-probe testing capabilities to support detailed analysis and verification processes.
• PCB Printing: High-quality printed circuit board services tailored to the specific needs of clients, enhancing electronic design and function.
• Value-Added Engineering Support: Comprehensive support covering sales, installation, technical assistance, process development, machine relocation, and design customization to enable client success.