Acm Research Inc. (813)
XSTU 
Summary
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ACM Research, Inc. (ACMR) is Attracting Investor Attention: Here is What You Should Know
Zacks.com users have recently been watching ACM Research (ACMR) quite a bit. Thus, it is worth knowing the facts that could determine the stock's prospects.
ACM Research, Inc. (ACMR) Is a Trending Stock: Facts to Know Before Betting on It
ACM Research (ACMR) has been one of the stocks most watched by Zacks.com users lately. So, it is worth exploring what lies ahead for the stock.
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As China boosts domestic fabs, ACMR gains ground. AMAT leads in AI chip tech.
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Acm Research Inc. Profile
| Semiconductors Industry | Technology Sector | Dr. Hui Wang Ph.D. CEO | XSTU Exchange | US00108J1097 ISIN |
| US Country | 2,023 Employees | - Last Dividend | 24 Mar 2022 Last Split | 3 Nov 2017 IPO Date |
Overview
ACM Research, Inc., established in 1998 and headquartered in Fremont, California, operates on a global scale, specializing in the development, manufacturing, and selling of single-wafer wet cleaning equipment. This equipment plays a critical role in enhancing the manufacturing process and yield of integrated chips used in various technologies around the world. ACM Research aims to improve semiconductor manufacturing through innovative cleaning technologies that address both current and emerging challenges faced by the industry.
Products and Services
- Space Alternated Phase Shift (SAPS) Technology:
Utilizes alternating phases of megasonic waves to deliver megasonic energy uniformly at a microscopic level. This is designed for both flat and patterned wafer surfaces, providing efficient cleaning while maintaining the integrity of delicate structures.
- Timely Energized Bubble Oscillation (TEBO) Technology:
Offers advanced cleaning for 2D and 3D patterned wafers at the most advanced process nodes. TEBO uses oscillating bubbles to gently yet effectively clean patterned wafer surfaces, helping to preserve feature details while removing contaminants.
- Tahoe Technology:
Delivers superior cleaning performance with reduced chemical consumption. This technology uses less sulfuric acid and hydrogen peroxide, making the cleaning process more environmentally friendly while maintaining high levels of cleanliness.
- Electro-Chemical Plating Technology:
Designed for advanced metal plating applications, this technology supports the deposition of metals with high precision and uniformity on semiconductor wafers. It is vital for creating the intricate patterns required in high-performance integrated circuits.
ACM Research, Inc. markets its innovative solutions under trademarks such as SAPS, TEBO, ULTRA C, ULTRA Fn, Ultra ECP, Ultra ECP map, and Ultra ECP ap. These products are sold directly to customers as well as through a network of third-party representatives, ensuring widespread availability and support for its technologies worldwide.
Contact Information
