Techbase Industries Bhd logo

Techbase Industries Bhd (8966)

Market Closed
11 Aug, 07:45
XKLS XKLS
RM
0. 05
-0
-9.0909%
RM
- Market Cap
- P/E Ratio
13,520% Div Yield
16,800 Volume
- Eps
RM 0.06
Previous Close
Add Transaction
Day Range
0.05 0.05
Year Range
0.05 0.14
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Name Ex-Dividend Date Dividend Payment Date Record Date Declaration Date Frequency
Heiwa Real Estate REIT Inc. logo
8966 Announced
Heiwa Real Estate REIT Inc.
Pay in 3 days
28 May 2026
¥3,990
14 Aug 2026
31 May 2026
-
Semi Annual
Heiwa Real Estate REIT Inc. logo
8966 Paid
Heiwa Real Estate REIT Inc.
1 Feb 2026
27 Nov 2025
¥3,950
1 Feb 2026
30 Nov 2025
-
Semi Annual

8966 Dividend FAQ

What is the dividend yield?

The current dividend yield for 8966 is 13,520%, based on the most recent dividend payment and the current stock price of RM0.05 on the XKLS.

How often are dividends paid?

Dividends are paid on a semi.annual basis, with typical payment being june and december.

When is the next dividend payment date?

Techbase Industries Bhd has not announced any upcoming dividend.

What is the dividend history?

The company has a dividend payment history that includes 0 years of consistent payments. The most recent payment was RM3,990.00 per share on 2026-05-28. For related earnings insights, visit the 8966 Earnings page.

What is the average annual dividend growth rate?

The average annual dividend growth rate over the past 0 years is approximately -2.21%, reflecting the 8966's commitment to rewarding shareholders.

How can I track 8966 dividends?

You can easily track 8966 dividend payments using our Dividend Tracker. It helps you monitor upcoming payment dates, yields, history, and more - all in one place.