Aspocomp Group Oyj logo

Aspocomp Group Oyj (ACG1Vh)

Market Open
CBOE CBOE
- Market Cap
- P/E Ratio
- Div Yield
- Volume
-0.29 Eps
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Summary

ACG1Vh is not paying dividends to its shareholders.
The last earnings report, released on Apr 29, 2026, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0.025%, based on the last three reports.
The stock of the company had never split.
The company's stock is traded on 4 different exchanges and in various currencies, with the primary listing on LSE (EUR).

Aspocomp Group Oyj (ACG1Vh) FAQ

On which exchange is it traded?

Aspocomp Group Oyj is listed on CBOE.

What is its stock symbol?

The ticker symbol is ACG1Vh.

Does it pay dividends? What is the current yield?

It does not pay dividends to its shareholders.

What is its market cap?

As of today, no market cap data is available.

Has Aspocomp Group Oyj ever had a stock split?

No, there has never been a stock split.

Aspocomp Group Oyj Profile

Electronic Equipment, Instruments & Components Industry
Information Technology Sector
Mr. Manu Skytta M.Sc. CEO
CBOE Exchange
FI0009008080 ISIN
Finland Country
164 Employees
- Last Dividend
- Last Split
- IPO Date

Overview

Aspocomp Group Oyj, headquartered in Espoo, Finland, is a prominent manufacturer and distributor of printed circuit boards (PCBs), serving a global clientele since its incorporation in 1999. The company has carved a niche in the PCB industry by specializing in a wide array of products tailored for critical applications in sectors like automotive, semiconductor, telecommunication infrastructure, industrial electronics, as well as security, and defense and aerospace. Aspocomp's operations span across Finland, Europe, and international markets, ensuring a broad reach and impact within the industry.

Products and Services

  • High Speed Digital PCBs:

    Designed to meet the demands of rapid signal processing, these PCBs are ideal for applications requiring high-speed data transmission, making them indispensable in the telecommunications and computing sectors.

  • Advanced High Density Interconnection (HDI) PCBs:

    These PCBs feature finely spaced interconnections, allowing for lighter, smaller, and more efficient devices. They're particularly suitable for compact electronic devices with high component density, such as smartphones and tablets.

  • High Layer Count Multilayer PCBs:

    Suitable for complex electronic systems, these multilayer PCBs support a higher number of layers to accommodate more components, improving functionality and performance in industries like aerospace and defense.

  • High Frequency PCBs:

    These are critical for applications requiring frequencies above the standard range, including advanced communication systems and R&D in the telecommunications sector.

  • PCBs with Component Cooling:

    Designed to address overheating issues in high-performance electronics, these PCBs incorporate solutions for effective cooling, enhancing reliability in automotive and industrial electronics.

  • Quick Turn Around Services:

    Aspocomp offers expedited PCB production services, enabling rapid delivery to meet tight deadlines, crucial for projects with strict timelines.

  • Design Support:

    To assist customers in developing efficient and reliable PCBs, Aspocomp provides design support services, leveraging its expertise to optimize product designs.

  • Logistics:

    Comprehensive logistics solutions ensure that PCBs are delivered on time and in perfect condition, regardless of the destination.

  • Global Supply:

    With a broad network of supply chains, Aspocomp ensures consistent availability and timely delivery of PCBs to meet global demands.

  • PCB Trading Services:

    Aspocomp extends beyond manufacturing, offering trading services that connect buyers with a diverse range of PCB products to suit various applications.

Contact Information

Address: Keilaranta 1
Phone: 358 2077 56860