Argo Global Listed Infrastructure Limited (ALI)

Overview

Kinik Company, established in 1953, stands as a renowned entity in the production and distribution of an extensive range of abrasives, cutting tools, and reclaimed wafers, catering to clients both domestically in Taiwan and on a global scale. The company is headquartered in New Taipei City, Taiwan, where it continues to innovate and expand its product offerings, maintaining a pivotal position in its industry. Through its longstanding history and commitment to quality, Kinik Company has solidified its reputation among manufacturers and industries requiring precision and durability in abrasive materials and tools.

Products and Services

• Conventional Grinding Wheels

  These wheels are designed for a wide variety of materials and provide a balance between material removal rates, precision, and durability. Ideal for both rough grinding and precision finishing.

• Diamond/CBN Grinding Wheels

  Utilizing the hardest materials available, these grinding wheels are suited for high-precision and high-efficiency applications, offering longevity and toughness in abrasive conditions.

• DLC Coatings

  Diamond-like carbon (DLC) coatings are applied to enhance surface properties such as hardness, wear resistance, and reduced friction, beneficial for tools and components in demanding environments.

• Reclaimed Wafers

  Kinik offers high-quality reclaimed wafers, providing a cost-effective and environmentally friendly alternative for semiconductor manufacturing and testing applications.

• Porous Ceramic Chuck Tables

  These provide uniform and strong holding power for materials during precision operations, crucial for semiconductor manufacturing and other applications requiring high precision.

• CMP Diamond Disks

  Designed for Chemical Mechanical Planarization (CMP) processes, these disks offer superior planarization capabilities, essential for the preparation of silicon wafers in semiconductor manufacturing.

• Ultra Precision Machining Tools

  These tools are engineered for tasks requiring utmost precision and are used in a variety of high-tech industries, including aerospace, automotive, and semiconductor sectors.

• Dicing Blades

  Specially designed blades for cutting or dicing hard materials such as silicon, ceramics, and glass, used extensively in the preparation of semiconductor components.

• Diamond Rollers

  These are utilized in forming and dressing abrasive grinding wheels, ensuring the wheels maintain their shape and precision throughout the grinding process.

• Wafer Grinding Wheels

  Specifically designed for the thinning of semiconductor wafers, these wheels offer high precision and minimal damage, crucial for the production of microelectronic devices.

• Diamond and CBN Honey Comb Wheels

  Featuring a unique honeycomb structure, these wheels provide exceptional cutting ability and cooling effects, suitable for high-speed and precision grinding applications.

• Anti-slip Type Vacuum Chucks

  These vacuum chucks are designed to hold materials in place through suction, facilitating precise machining or grinding without slippage, enhancing safety and efficiency.