ChipMOS Technologies Inc. (CPIA)
XSTU 
Summary
CPIA Chart
ChipMOS ADJUSTS CASH DIVIDEND DISTRIBUTION RATIO TO APPROXIMATELY NT$1.23 PER COMMON SHARE OR APPROXIMATELY US$0.82 PER ADS
HSINCHU, June 13, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), announced that the Company adjusted the cash dividend distribution ratio from NT$1.20 per common share to approximately NT$1.23 per common share, following the Company's cancellation of treasury shares and the repurchase of shares for transfer to employees, which impacted the total number of the Company's outstanding shares.
ChipMOS REPORTS 8.8% MoM INCREASE IN MAY 2025 REVENUE
HSINCHU, June 10, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of May 2025.
ChipMOS SHAREHOLDERS APPROVE NT$1.20 PER COMMON SHARE OR APPROXIMATELY US$0.80 PER ADS CASH DIVIDEND DISTRIBUTION
HSINCHU, May 28, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), announced that at the Company's AGM on May 27, 2025 shareholders approved a NT$1.20 per common share or approximately US$0.80 per ADS cash dividend distribution from its prior year's earnings.
ChipMOS Technologies Inc. Dividends
| IMOS In 1 week Announced | Annual | $0.8 Per Share |
| IMOS 11 months ago Paid | Annual | $1.11 Per Share |
| IMOS 29 Jun 2023 Paid | Annual | $1.5 Per Share |
| IMOS 29 Jun 2022 Paid | Annual | $2.92 Per Share |
| IMOS 6 Aug 2021 Paid | Annual | $1.57 Per Share |
ChipMOS Technologies Inc. Earnings
| 9 May 2025 Date | | - Cons. EPS | 0.15 EPS |
| 22 Feb 2025 Date | | - Cons. EPS | 0.19 EPS |
| 5 Nov 2024 Date | | - Cons. EPS | 0.25 EPS |
| 2 Nov 2024 Date | | - Cons. EPS | - EPS |
| 13 Aug 2024 Date | | - Cons. EPS | 0.38 EPS |
| IMOS In 1 week Announced | Annual | $0.8 Per Share |
| IMOS 11 months ago Paid | Annual | $1.11 Per Share |
| IMOS 29 Jun 2023 Paid | Annual | $1.5 Per Share |
| IMOS 29 Jun 2022 Paid | Annual | $2.92 Per Share |
| IMOS 6 Aug 2021 Paid | Annual | $1.57 Per Share |
| 9 May 2025 Date | | - Cons. EPS | 0.15 EPS |
| 22 Feb 2025 Date | | - Cons. EPS | 0.19 EPS |
| 5 Nov 2024 Date | | - Cons. EPS | 0.25 EPS |
| 2 Nov 2024 Date | | - Cons. EPS | - EPS |
| 13 Aug 2024 Date | | - Cons. EPS | 0.38 EPS |
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ChipMOS Technologies Inc. Profile
| Semiconductors Industry | Technology Sector | Mr. Shih-Jye Cheng CEO | XSTU Exchange | US16965P2020 ISIN |
| TW Country | 5,688 Employees | 27 Jun 2025 Last Dividend | 31 Oct 2016 Last Split | - IPO Date |
Overview
ChipMOS TECHNOLOGIES INC. is a leading provider in the semiconductor industry, dedicated to the research, development, manufacturing, and sales of high-integration and high-precision integrated circuits, along with related assembly and testing services. With operations spanning the People's Republic of China, Japan, Singapore, and other global markets, the company delivers comprehensive solutions through its diverse service segments including Testing, Assembly, Testing and Assembly for LCD, OLED, and Other Display Panel Driver Semiconductors, Bumping, and Others. Founded in 1997 and headquartered in Hsinchu, Taiwan, ChipMOS has solidified its presence in the semiconductor sector by catering to a wide array of applications from personal computing and graphics to communications, mobile products, and automotive/industrial display panels.
Products and Services
ChipMOS TECHNOLOGIES INC. offers a wide range of back-end assembly and testing services vital to the semiconductor industry:
- Engineering Test, Wafer Probing, and Final Test: Specialized services for both memory and logic/mixed-signal semiconductors, focusing on ensuring the performance and reliability of the chips before they go to market.
- Leadframe-based and Organic Substrate-based Package Assembly: Provides essential assembly services for memory and logic/mixed-signal semiconductors, utilizing both leadframe and organic substrate technologies to meet different requirement and application needs.
- Gold Bumping: Offers gold bumping services, a critical process for creating connections on chips before they are packaged, which is essential for LCD, OLED, and other display drivers.
- Reel to Reel Assembly and Test Services: Tailored for LCD, OLED, and other panel display driver semiconductors, these services ensure that display technologies meet the stringent quality requirements before integration into consumer products.
The range of services offered by ChipMOS caters to a broad scope of applications, including but not limited to personal computers, gaming consoles, communications equipment, mobile devices like cellular handsets and tablets, consumer electronics, as well as automotive and industrial display applications. This extensive portfolio highlights ChipMOS’s commitment to supporting the evolving needs of the semiconductor industry with high-quality, precision-driven solutions.
Contact Information
