Disco Corporation Unsponsored ADR (D650)
XFRA 
OTC PINK Primary XFRA Summary
D650 Chart
This U.S. politician is hunting semiconductor stocks before they rocket
Following a trend among U.S. politicians, Representative Josh Gottheimer of New Jersey's 5th congressional district reported a large number of stock market trades on November 6 – just as the nation was closely following the 2024 presidential election.
DISCO CORP (DSCSY) Upgraded to Strong Buy: Here's What You Should Know
DISCO CORP (DSCSY) has been upgraded to a Zacks Rank #1 (Strong Buy), reflecting growing optimism about the company's earnings prospects. This might drive the stock higher in the near term.
Is DISCO CORP (DSCSY) Stock Outpacing Its Industrial Products Peers This Year?
Here is how DISCO CORP (DSCSY) and Flowserve (FLS) have performed compared to their sector so far this year.
Disco Corporation Unsponsored ADR (D650) FAQ
What is the stock price today?
On which exchange is it traded?
What is its stock symbol?
Does it pay dividends? What is the current yield?
What is its market cap?
Has Disco Corporation Unsponsored ADR ever had a stock split?
Disco Corporation Unsponsored ADR Profile
| Semiconductors & Semiconductor Equipment Industry | Information Technology Sector | Kazuma Sekiya CEO | XFRA Exchange | US25461D1000 ISIN |
| JP Country | 5,547 Employees | 30 Mar 2026 Last Dividend | 4 Apr 2023 Last Split | - IPO Date |
Overview
Disco Corporation, founded in 1937 and headquartered in Tokyo, Japan, specializes in the manufacture and sale of precision cutting, grinding, and polishing machines on both a national and international scale. The company's wide array of products serves various sectors, notably semiconductor manufacturing, by offering equipment solutions for dicing, grinding, and polishing processes. Beyond equipment manufacturing, Disco Corporation engages in comprehensive after-sale services including maintenance, disassembly, recycling, and training for equipment operation and maintenance. Furthermore, the company expands its offerings through the leasing of precision machines, dealing in used machines, producing precision diamond abrasive tools, and providing chargeable processing services.
Products and Services
- Precision Machines: Including dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws. These machines are designed for the precision processing required in semiconductor manufacturing and other high-tech industries.
- Precision Processing Tools: Such as dicing blades, grinding wheels, and dry polishing wheels. These tools complement the machines by providing the necessary consumables for cutting, grinding, and polishing processes.
- Accessory Equipment and Related Products: Including cut-off wheels among other accessories designed to enhance the functionality and efficiency of the primary precision machines.
- Maintenance, Disassembly, and Recycling Services: Offering comprehensive post-sale support for the upkeep and sustainable disposal of its precision machines, ensuring longevity and conformity to sustainability standards.
- Training Services: Providing customers with training on the maintenance and operation of machines, ensuring optimized usage and extended machine life.
- Leasing Services: For businesses demanding flexibility, the company offers precision machines on lease, allowing for adaptability in both operations and financial planning.
- Used Machine Trading: Engaged in the purchase and sale of used machines, offering an economical alternative to customers while facilitating the reuse of equipment.
- Precision Diamond Abrasive Tools: Manufactures and sells high-quality diamond tools that are vital for many precision processing applications, highlighting the company’s capability in producing critical components for machining processes.
- Chargeable Processing Services: Provides specialized processing services on a chargeable basis, offering customers additional options for their manufacturing and processing needs.
