Mec Co. Ltd. (MECGF)

Overview

MEC Company Ltd. is a pioneering firm that specializes in the realm of chemical, equipment, and material innovation specifically catering to the production of printed circuit boards (PCBs). Founded in 1969 and with its headquarters based in Amagasaki, Japan, the company has established itself as a leader in the research and development, production, and sale of a broad array of products critical to the PCB manufacturing process. With an unwavering commitment to technological advancement and customer satisfaction, MEC Company Ltd. has been at the forefront of delivering solutions that enhance the performance and reliability of electronic substrates.

Products and Services

• Roughening Type Adhesion Enhancement: This solution is designed to improve the adhesion between layers in PCBs through surface roughening techniques, ensuring a more durable and reliable electronic substrate.
• Rolled Annealed Copper Roughening Treatment: Specifically targets the roughening of rolled annealed copper surfaces to improve bonding in the manufacturing process.
• Pre-Lamination Treatment of Multilayer Substrates and Adhesion Enhancement for High-Frequency Substrates: A pre-treatment process aimed at enhancing the adhesion between layers in multilayer substrates and high-frequency PCB substrates, critical for ensuring structural integrity and performance.
• Anisotropic Etching and Seed Layer Etching: This technique involves the selective removal of material on the substrate to create patterns or channels, essential in the formation of circuitry on PCBs.
• Copper Surface Treatment for CO2 Laser Direct Drilling: An innovative approach to preparing copper surfaces for direct drilling with CO2 lasers, enhancing precision and cleanliness in the creation of vias and connections.
• Degreasing, Rust Removal, Temporary Anti-Tarnish: A series of treatments aimed at preparing metal surfaces by removing grease, rust, and preventing tarnish temporarily, thereby ensuring optimum condition for subsequent processing steps.
• Other Metal Surface Treatment: A broad category that includes various treatments designed to prepare or modify metal surfaces for specific manufacturing requirements.
• DFR Pre-Treatment: A pre-treatment process for DFR (Dry Film Resist), essential in ensuring optimal adherence and functionality of the resist in PCB manufacturing.
• Microetching: A fine and controlled etching process that cleans and micro-roughens the surface to improve adhesion and mechanical interlocking of subsequent layers.
• Various Residue Removal Treatment: This encompasses a range of treatments aimed at removing any unwanted residues from the PCB manufacturing process, ensuring a clean and defect-free final product.
• AMALPHA: An exclusive metal surface treatment technology developed by MEC Company Ltd. for direct metal and resin bonding, offering superior bonding strength and reliability.