Mi Technovation Bhd (MITNF)
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Mi Technovation Bhd Profile
| Semiconductors & Semiconductor Equipment Industry | Information Technology Sector | Kuang Oh CEO | OTC PINK Exchange | MYL5286OO009 ISIN |
| MY Country | 589 Employees | 12 Jun 2026 Last Dividend | - Last Split | - IPO Date |
Overview
Mi Technovation Berhad, headquartered in Bayan Lepas, Malaysia, operates as an investment holding company with a primary focus on the semiconductor industry across various regions including Southeast Asia, Northeast Asia, and the North Atlantic. The company, established in 2007 and experiencing a name change from Mi Equipment Holdings Berhad to Mi Technovation Berhad in December 2018, has sculpted a niche for itself by engaging in the design, development, manufacture, and sale of semiconductor manufacturing equipment. Its operations are segmented into three distinct units: Semiconductor Equipment Business Unit, Semiconductor Material Business Unit, and Semiconductor Solutions Business Unit, each contributing to the ecosystem of semiconductor manufacturing with a range of products and services.
Products and Services
- Semiconductor Equipment Business Unit
Operates in the assembly and packaging sector, offering equipment essential for vision inspection, laser-assisted bonding, and power and final test operations. This unit not only sells machines but also provides comprehensive maintenance services and technical support, along with the necessary spare parts and components.
- Semiconductor Material Business Unit
Provides essential semiconductor materials with a focus on solder spheres in different forms including small, ultra-small, ultralow alpha solder, and copper core solder balls. These materials are integral for ball grid array and wafer level packaging processes within the semiconductor manufacturing industry.
- Semiconductor Solutions Business Unit
Offers an array of high power modules and devices geared towards wide bandgap applications in impactful sectors such as automotive and renewable energy. Besides this, the unit is heavily involved in the design, development, manufacture, and sale of wafer level chip scale packaging sorting, as well as precision bonding machines. Furthermore, it extends its expertise by providing management services, along with research and development, manufacture, sale, and marketing of specific processes and application services in assembly and packaging solutions tailored for customer requirements.
