Plan Optik AG logo

Plan Optik AG (P4O)

Market Closed
5 Jun, 20:00
XFRA XFRA
12. 60
+0.45
+3.7037%
- Market Cap
- P/E Ratio
0.12% Div Yield
1,900 Volume
- Eps
12.15
Previous Close
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Day Range
12.6 12.6
Year Range
3.08 15.45
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Summary

P4O closed today higher at €12.6, an increase of 3.7037% from yesterday's close, completing a monthly decrease of -4.1825% or -€0.55. Over the past 12 months, P4O stock gained 170.3863%.
P4O is not paying dividends to its shareholders.
The last earnings report, released on Jun 25, 2024, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports.
Plan Optik AG has completed 3 stock splits, with the recent split occurring on Mar 06, 2012.
The company's stock is traded on 5 different exchanges and in various currencies, with the primary listing on XETRA (EUR).

P4O Chart

Plan Optik AG (P4O) FAQ

What is the stock price today?

The current price is €12.60.

On which exchange is it traded?

Plan Optik AG is listed on XFRA.

What is its stock symbol?

The ticker symbol is P4O.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.12%.

What is its market cap?

As of today, no market cap data is available.

Has Plan Optik AG ever had a stock split?

Plan Optik AG had 3 splits and the recent split was on Mar 06, 2012.

Plan Optik AG Profile

Electronic Equipment, Instruments & Components Industry
Information Technology Sector
- CEO
XFRA Exchange
D6132C107 CUSIP
Germany Country
107 Employees
26 Jun 2014 Last Dividend
19 Sep 2006 Last Split
- IPO Date

Overview

Plan Optik AG is a German company headquartered in Elsoff, specializing in the manufacturing and distribution of structured wafers. The company's offerings cover a wide range of products designed for various industries such as consumer electronics, automotive, aerospace, chemistry, and pharmaceuticals. With its advanced manufacturing capabilities, Plan Optik AG provides a comprehensive array of services ranging from mechanical processing and prototyping to vacuum casting and injection molding. This diversified product base and service portfolio positions Plan Optik AG as a key player in the supply of critical components for technological applications.

Products and Services

  • Glass Wafers: Plan Optik AG produces an extensive line of glass wafers, including types made from borosilicate, quartz, fused silica, and alkaline-free materials. Additionally, they offer silicon-on-glass wafers. These products serve pivotal roles in various applications across consumer electronics, aerospace, and more.
  • Carriers and Tools: The company offers a versatile selection of carriers and tools designed for safe and efficient wafer handling. This includes chemical release, thermal release, laser release, and mechanical release carriers, as well as adapter wafer and handling tools. These carriers and tools ensure the integrity of wafers during processing and transportation.
  • Packaging Wafers: Plan Optik AG specializes in manufacturing packaging wafers such as through hole wafers, cavity wafers, trenched wafers, and customized cap solutions, along with wafers that feature structured SI-layers. These packaging solutions cater to the need for secure encapsulation of microelectronics and MEMS devices.
  • Interposers: The company's product line includes both glass and SI interposers, along with through glass vias and redistribution layers. Interposers are crucial for creating electrical connections between integrated circuits and substrates, enhancing device performance and integration.
  • Microfluidics: Plan Optik AG's microfluidic solutions such as micro reactors, fluidic chips, flow chemistry sets, and sensors offer advanced capabilities for the pharmaceutical and chemistry industries. These products enable precise fluid control and analysis, which are essential for research and development in these fields.

In addition to its product line, Plan Optik AG offers a suite of services that include mechanical processing, prototyping, vacuum casting, injection molding, patterning, wafer thinning, coating, wire sawing, and bonding services. These services are designed to provide comprehensive support across all phases of product development and manufacturing, reflecting the company's commitment to quality and customer satisfaction in its offerings.

Contact Information

Address: Ueber der Bitz 3
Phone: 49 2664 5068 0