Tokyo Electron Ltd. logo

Tokyo Electron Ltd. (TOELF)

Market Closed
10 Aug, 20:00
OTC PINK OTC PINK
$
353. 05
+11.48
+3.3609%
$
85.43B Market Cap
- P/E Ratio
0.71% Div Yield
23 Volume
- Eps
$ 341.57
Previous Close
Add Transaction
Day Range
353.05 370
Year Range
130.17 509.3
Want to track TOELF and more in your Portfolio? 🎯
Sign up for Marketlog, a portfolio tracker that will exceed your expectations!
Upcoming TOELF split of 5:1 in 49 days (29 Sep 2026)

Summary

TOELF closed today higher at $353.05, an increase of 3.3609% from yesterday's close, completing a monthly decrease of -26.9939% or -$130.54. Over the past 12 months, TOELF stock gained 57.0158%.
TOELF pays dividends to its shareholders, with the most recent payment made on May 28, 2025. The next estimated payment will be in 28 May 2025 on May 28, 2025 for a total of $1.8093.
The last earnings report, released on Apr 30, 2026, missed the consensus estimates by -392.2%. On average, the company has fell short of earnings expectations by -307.5993%, based on the last three reports.
Tokyo Electron Ltd. has a scheduled stock split on Sep 29, 2026 for a 5:1 split ratio, meaning every TOELF investor will receive 5.0 shares for every 1.0 existing shares.
Tokyo Electron Ltd. has completed 2 stock splits, with the recent split occurring on Mar 30, 2023.
The company's stock is traded on 7 different exchanges and in various currencies, with the primary listing on JPX (JPY).

TOELF Chart

People also search for

Airbus SE
$ 61.79
+0.2433%
Schneider Electric SE - Unsponsored ADR
$ 69.57
-0.4721%
ABB Ltd. Sponsored ADR
$ 100.65
-0.2082%
Rolls-Royce Holdings plc
$ 20.64
+0.097%
Safran S.A.
$ 104.49
+1.4171%

Tokyo Electron Ltd. (TOELF) FAQ

What is the stock price today?

The current price is $353.05.

On which exchange is it traded?

Tokyo Electron Ltd. is listed on OTC PINK.

What is its stock symbol?

The ticker symbol is TOELF.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.71%.

What is its market cap?

As of today, the market cap is 85.43B.

Has Tokyo Electron Ltd. ever had a stock split?

Tokyo Electron Ltd. had 2 splits and the recent split was on Mar 30, 2023.

Tokyo Electron Ltd. Profile

Passenger Airlines Industry
Industrials Sector
Tony Kawai CEO
OTC PINK Exchange
JP3571400005 ISIN
JP Country
17,702 Employees
29 Sep 2026 Last Dividend
29 Sep 2026 Last Split
- IPO Date

Overview

Tokyo Electron Limited is a pivotal player in the development, manufacturing, and sale of semiconductor and flat panel display (FPD) production equipment. With a footprint that spans Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and other international markets, the company positions itself as a global leader. Integrated within its operations are various subsidiaries that contribute to its expansive product portfolio and technical innovations. Tokyo Electron Limited, since its inception in 1951, and with its headquarters in Tokyo, Japan, has cultivated a reputation for excellence in the semiconductor and FPD production equipment arena.

Products and Services

  • Coaters/Developers: Equipments designed for applying and developing material layers on semiconductor wafers.
  • Etch Systems: Systems used to selectively remove material from the surface of a wafer to create semiconductor devices.
  • Surface Preparation Systems: Technologies used for the cleaning and preparation of semiconductor wafer surfaces prior to processing.
  • Deposition Systems: Equipment employed for depositing various types of materials onto wafers.
  • Test Systems: Devices designed for testing the electrical properties of semiconductors during the manufacturing process.
  • Wafer Bonders/Debonders: Machines used for bonding wafers together and then separating them after processes are completed.
  • Wafer Edge Trimming: Equipment tailored for trimming the edge of semiconductor wafers to prepare them for further processing.
  • SiC Epitaxial CVD Systems: Specialized systems for depositing silicon carbide (SiC) on semiconductor devices, benefiting high-power applications.
  • Gas Cluster Ion Beam System: A system used for surface modification, including etching and deposition processes, using cluster ion beams.
  • Cleaning Systems: Technologies focused on the removal of contaminants from semiconductor wafers to ensure quality and reliability.
  • Plasma Etch/Ash Systems: Critical in the manufacturing of flat panel displays (FPDs), these systems are used for etching materials or removing photoresist through plasma technology.
  • Inkjet Printing Systems for OLED Displays: Advanced printing systems designed specifically for the production of OLED displays using inkjet technology.
  • Delivery, Facility Management, and Non-Life Insurance Services: Supplementary services to support the core manufacturing processes, including material delivery, facility management, and insurance coverage.
  • Sale of Semiconductor Products, Board Computer Products, Software, and Other Electronic Components: Distribution of a wide range of semiconductor-related products, highlighting the company's diverse offerings.
  • Network/Storage/Middleware Related Solutions: Providing sales and support for solutions that enhance network storage and middleware capabilities.
  • Magnetic Annealing Systems: Devices developed for the process of magnetically annealing semiconductors to improve their magnetic properties.

Contact Information

Address: Akasaka Biz Tower
Phone: 81 3 5561 7000