Tokyo Ohka Kogyo Co., Ltd. logo

Tokyo Ohka Kogyo Co., Ltd. (TOKCF)

Market Closed
7 Aug, 20:00
OTC GREY OTC GREY
$
52. 67
0
0%
$
7.93B Market Cap
- P/E Ratio
0.47% Div Yield
200 Volume
- Eps
$ 52.67
Previous Close
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Day Range
52.67 52.67
Year Range
20.16 71.73
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Summary

TOKCF closed Friday higher at $52.67, an increase of 0% from Thursday's close, completing a monthly decrease of -26.5719% or -$19.06. Over the past 12 months, TOKCF stock gained 49.7157%.
TOKCF pays dividends to its shareholders, with the most recent payment made on Mar 30, 2026. The next estimated payment will be in 4 months ago on Mar 30, 2026 for a total of $0.2266.
The last earnings report, released on Feb 11, 2025, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0.0978%, based on the last three reports.
Tokyo Ohka Kogyo Co., Ltd. has completed 1 stock splits, with the recent split occurring on Dec 28, 2023.
The company's stock is traded on 3 different exchanges and in various currencies, with the primary listing on JPX (JPY).

TOKCF Chart

Tokyo Ohka Kogyo Co., Ltd. (TOKCF) FAQ

What is the stock price today?

The current price is $52.67.

On which exchange is it traded?

Tokyo Ohka Kogyo Co., Ltd. is listed on OTC GREY.

What is its stock symbol?

The ticker symbol is TOKCF.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.47%.

What is its market cap?

As of today, the market cap is 7.93B.

Has Tokyo Ohka Kogyo Co., Ltd. ever had a stock split?

Tokyo Ohka Kogyo Co., Ltd. had 1 splits and the recent split was on Dec 28, 2023.

Tokyo Ohka Kogyo Co., Ltd. Profile

Electronic Equipment, Instruments & Components Industry
Information Technology Sector
Mr. Noriaki Taneichi CEO
OTC GREY Exchange
JP3571800006 ISIN
US Country
2,132 Employees
29 Jun 2026 Last Dividend
28 Dec 2023 Last Split
- IPO Date

Overview

Tokyo Ohka Kogyo Co., Ltd. (TOK) is a prominent player in the global chemical manufacturing scene, offering a wide range of chemical products and process equipment. Established in 1940 and based in Kawasaki, Japan, the company operates on a global scale, delivering innovative solutions for various industries. TOK specializes in the production and sale of photoresists and related equipment, catering to the ever-growing demands of the semiconductor, mobile device, and electronics sectors, among others. The company's commitment to quality and innovation has helped it secure a strong market position, serving customers worldwide with cutting-edge materials and machinery designed to enhance manufacturing efficiency and product performance.

Products and Services

  • Photoresists and Related Equipment: TOK offers advanced photoresists which are crucial for the lithography process in semiconductor manufacturing, along with equipment designed to optimize their application.
  • Process Equipment: The company provides a comprehensive range of process equipment, including coating, developing, vacuum UV hardening, and chemical supply machines, essential for various stages of semiconductor fabrication.
  • Adhesive Materials: TOK manufactures adhesive materials tailored for multiple industrial applications, accompanied by thinners for the removal of these adhesives.
  • Structural Materials: Structural materials developed by TOK are designed to support the integrity and durability of electronic devices and components.
  • Surface Modification Materials: These materials are used to alter the surface properties of substrates to improve adhesion, durability, or functionality, catering to specific manufacturing needs.
  • Micro Processing Films: TOK's micro-processing films are pivotal for the detailed patterning required in electronic component manufacturing.
  • Thin Film mmWave Absorbers: These are specialized materials designed to absorb millimeter-wave frequencies, increasingly important for 5G technology and advanced radar systems.
  • Polyimide Films: Known for their high thermal stability and electrical insulation properties, TOK's polyimide films are indispensable in electronic and aerospace industries.
  • Zero Newton Bonding and De-bonding Machines: These machines facilitate 3D semiconductor packaging by allowing for the precise bonding and subsequent debonding of wafers and other components.

In addition to its extensive product line, TOK also offers insurance agency services, broadening its portfolio and providing auxiliary support to its clients. The company leverages its deep industrial knowledge and technical expertise to drive innovation across sectors, with applications ranging from consumer electronics to renewable energy equipment and automotive technologies. Through its diversified offerings, Tokyo Ohka Kogyo Co., Ltd. plays a crucial role in the advancement of modern technology and sustainable development.

Contact Information

Address: 150 Nakamaruko, Kawasaki, Japan, 211-0012
Phone: 81 44 435 3000