Tongfu Microelectronics Co., Ltd. logo

Tongfu Microelectronics Co., Ltd. (002156)

Market Closed
10 Aug, 06:57
XSHE XSHE
¥
63. 20
-1.52
-2.3486%
¥
55.56B Market Cap
- P/E Ratio
0.05% Div Yield
102.39M Volume
- Eps
¥ 64.72
Previous Close
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Day Range
60.94 64.83
Year Range
26.81 84.7
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Summary

002156 closed today lower at ¥63.2, a decrease of -2.3486% from yesterday's close, completing a monthly decrease of -17.0604% or -¥13. Over the past 12 months, 002156 stock gained 65.7488%.
002156 pays dividends to its shareholders, with the most recent payment made on May 28, 2026. The next estimated payment will be in In 9 months on May 28, 2027 for a total of ¥0.081.
The last earnings report, released on Apr 17, 2026, missed the consensus estimates by -0.2816%. On average, the company has fell short of earnings expectations by -0.0783%, based on the last three reports.
Tongfu Microelectronics Co., Ltd. has completed 3 stock splits, with the recent split occurring on May 31, 2016.
The company's stock is traded on one exchange.

002156 Chart

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Tongfu Microelectronics Co., Ltd. (002156) FAQ

What is the stock price today?

The current price is ¥63.20.

On which exchange is it traded?

Tongfu Microelectronics Co., Ltd. is listed on XSHE.

What is its stock symbol?

The ticker symbol is 002156.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.05%.

What is its market cap?

As of today, the market cap is 55.56B.

Has Tongfu Microelectronics Co., Ltd. ever had a stock split?

Tongfu Microelectronics Co., Ltd. had 3 splits and the recent split was on May 31, 2016.

Tongfu Microelectronics Co., Ltd. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
Mr. Shi Lei CEO
XSHE Exchange
CNE1000006C3 ISIN
CN Country
20,062 Employees
28 May 2026 Last Dividend
31 May 2016 Last Split
16 Aug 2007 IPO Date

Overview

Tongfu Microelectronics Co.,Ltd is a key player in the semiconductor industry, specializing in integrated circuit (IC) packaging and testing services. The company has a significant presence in the sector, providing a comprehensive suite of services to address the diverse needs of IC manufacturers. Initially established as Nantong Fujitsu Microelectronics Co., Ltd, the organization underwent a name change to Tongfu Microelectronics Co.,Ltd in December 2016, marking a new era in its corporate journey. Since its foundation in 1994, Tongfu Microelectronics has been committed to excellence and innovation in semiconductor testing, underpinning its status as an industry leader. Headquartered in Nantong, China, the company leverages its strategic location to serve clients across the globe, providing cutting-edge solutions for the rapidly evolving semiconductor market.

Products and Services

  • Wafer Probe and Strip Testing

    This service involves the electrical testing of silicon wafers and the identification of defective units before they proceed to the packaging phase. It's a critical step in ensuring the reliability of semiconductor devices.

  • Final Testing

    After packaging, semiconductor devices undergo final testing to verify their functionality and performance under conditions that mimic their intended operational environment. This ensures that only devices meeting stringent quality standards reach the market.

  • System Level Testing

    Tongfu Microelectronics performs system level testing to evaluate the performance of semiconductor devices within a system, ensuring they meet the specific requirements of applications such as automotive, computing, and consumer electronics.

  • Test Platform and Engineering Services

    The company offers customized testing solutions and engineering services for a wide range of devices including analog and mixed signal, automotive, radio frequency, high-performance compute devices, baseband, memory devices, LCD driver devices, SiP devices, and power module devices. This diverse service portfolio addresses the complexities of modern integrated circuits.

  • Test Products

    Tongfu Microelectronics offers a variety of test products for CPUs, GPUs, gaming consoles, and networking products. This range illustrates the company's ability to adapt to the dynamic nature of the semiconductor industry and cater to the testing needs of devices integral to today's digital infrastructure.

Contact Information

Address: No. 288 Chongchuan Road, Nantong, China, 226006
Phone: 86 513 8505 8919