Shenzhen Fastprint Circuit Co., Ltd. (002436)

Overview

Shenzhen Fastprint Circuit Tech Co.,Ltd. is a distinguished manufacturer and international seller of Printed Circuit Boards (PCBs) based in Shenzhen, China. Since its inception in 1993, Fastprint has been at the forefront of delivering advanced PCB solutions to a wide array of industries including communication devices, vehicle and medical electronics, rail transit, computers and peripherals, semiconductor integrated circuits, and more. With a focus on innovation and quality, the company has established itself as a key player in the global PCB market, serving trade, education, and industrial control sectors among others.

Products and Services

• HDI: High-Density Interconnector PCBs that offer higher wiring densities per unit area than traditional boards. These are particularly useful in compact electronic devices where space and weight are critical factors.
• High Frequency: PCBs designed to perform exceptionally well in high-frequency applications. These boards are vital in telecommunications and RF (radio frequency) applications to ensure minimal signal loss and maximum performance.
• High Speed: PCBs optimized for high-speed electronic signals. Ideal for applications requiring fast signal processing, these boards minimize signal loss and cross-talk, pivotal in high-speed communication and computing.
• Rigid-Flex and Flexible Boards: These PCBs combine the benefits of rigid and flexible circuitry in one board, offering enhanced reliability and flexibility in design. They are widely used in electronic devices requiring flexible form factors.
• Load Boards, Probe Card, BIB, and Interposer Semiconductor Test Boards: Specialized PCBs designed for testing and validation of semiconductor chips and components. These boards are essential in ensuring the functionality and reliability of semiconductor devices before they are integrated into larger systems.
• IC Substrates: Substrate materials used for IC (Integrated Circuit) packaging. These serve as the bridge between IC chips and PCBs, enabling communication and power transfer. IC substrates are fundamental in the assembly of electronic devices, providing structural support and electrical connectivity to the semiconductor chips.