Ingenic Semiconductor Co., Ltd. logo

Ingenic Semiconductor Co., Ltd. (300223)

Market Closed
10 Aug, 06:57
XSHE XSHE
¥
138. 48
-5.57
-3.8667%
¥
44.22B Market Cap
- P/E Ratio
0.1% Div Yield
39.69M Volume
- Eps
¥ 144.05
Previous Close
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Day Range
135.05 144.92
Year Range
67.38 279.44
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Summary

300223 closed today lower at ¥138.48, a decrease of -3.8667% from yesterday's close, completing a monthly decrease of -44.1613% or -¥109.52. Over the past 12 months, 300223 stock gained 26.9411%.
300223 pays dividends to its shareholders, with the most recent payment made on May 20, 2026. The next estimated payment will be in In 9 months on May 20, 2027 for a total of ¥0.15.
The last earnings report, released on Mar 28, 2026, missed the consensus estimates by -0.2489%. On average, the company has fell short of earnings expectations by -0.107%, based on the last three reports.
Ingenic Semiconductor Co., Ltd. has completed 3 stock splits, with the recent split occurring on Jun 12, 2018.
The company's stock is traded on one exchange.

300223 Chart

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Ingenic Semiconductor Co., Ltd. (300223) FAQ

What is the stock price today?

The current price is ¥138.48.

On which exchange is it traded?

Ingenic Semiconductor Co., Ltd. is listed on XSHE.

What is its stock symbol?

The ticker symbol is 300223.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.1%.

What is its market cap?

As of today, the market cap is 44.22B.

Has Ingenic Semiconductor Co., Ltd. ever had a stock split?

Ingenic Semiconductor Co., Ltd. had 3 splits and the recent split was on Jun 12, 2018.

Ingenic Semiconductor Co., Ltd. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
Mr. Qiang Liu CEO
XSHE Exchange
CNE100001377 ISIN
China Country
1,160 Employees
20 May 2026 Last Dividend
12 Jun 2018 Last Split
31 May 2011 IPO Date

Overview

Ingenic Semiconductor Co.,Ltd. is a prominent player in the semiconductor industry, focusing primarily on the research, development, and commercialization of integrated circuit chip products. Founded in 2005 and with its headquarters in Beijing, China, the company has established a significant global presence, offering innovative solutions to a vast range of markets including automotive electronics, industrial and medical devices, communication equipment, and consumer electronics. By integrating cutting-edge technology with a comprehensive understanding of market needs, Ingenic Semiconductor Co.,Ltd. maintains its commitment to innovation, quality, and customer satisfaction in the ever-evolving tech landscape.

Products and Services

  • Low Power Image Recognition: Offering cutting-edge solutions designed for applications requiring efficient image recognition with minimal power consumption.
  • Multi-Core Heterogeneous Crossover: Specializing in the development of multi-core processors that optimize performance through the integration of heterogeneous technologies.
  • Low-Power AIoT: Focused on advancing the AIoT sector with products that combine artificial intelligence and the Internet of Things in energy-efficient ways.
  • Ultra-Low-Power IoT Micro-Processors: Providing processors specifically designed for IoT devices, prioritizing ultra-low power consumption to extend device lifespan and functionality.
  • AI Video Processor: Developing high-performance processors that enable advanced video analytics and processing capabilities for AI-enhanced video applications.
  • Video and AI Vision Application Processor: Offering sophisticated processors that support complex video and AI vision applications, enabling smarter and more responsive devices.
  • Professional Security Backend Processor: Tailoring solutions for the security industry with processors designed to handle the demanding computational needs of professional security systems.
  • Balanced Video Processor: Engineers processors that maintain a balance between high-performance video processing capabilities and power efficiency, ideal for a variety of applications.
  • Memory Chips: Produces a wide range of memory chip solutions designed to meet the diverse needs of the tech industry, from storage to high-speed data processing.
  • Analog and Interconnection Chips: Offers chips that provide the essential analog and interconnect functionality for complex electronic devices, ensuring reliable performance and integration.
  • CPU, VPU, AI Engine, and Image Signal Processor Technologies: Develops a broad spectrum of core technologies that are critical for powering today’s most advanced electronic devices, from central and visual processing units to specialized AI engines and ISPs.

Contact Information

Address: Junzheng Building, No.14
Phone: 86 10 5634 5000