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Boeing Semiconductor Technology Corp. (300323)

Market Open
11 Aug, 06:57
XSHE XSHE
¥
11. 92
-0.08
-0.6667%
¥
12.45B Market Cap
- P/E Ratio
0.18% Div Yield
11.93M Volume
- Eps
¥ 12
Previous Close
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Day Range
11.8 12
Year Range
7.23 22.7
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Summary

300323 trading today lower at ¥11.92, a decrease of -0.6667% from yesterday's close, completing a monthly decrease of -39.1837% or -¥7.68. Over the past 12 months, 300323 stock gained 49.5609%.
300323 is not paying dividends to its shareholders.
The last earnings report, released on Mar 23, 2026, exceeded the consensus estimates by 0%. On average, the company has fell short of earnings expectations by -0.0202%, based on the last three reports.
Boeing Semiconductor Technology Corp. has completed 3 stock splits, with the recent split occurring on Jun 04, 2015.
The company's stock is traded on one exchange.

300323 Chart

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Boeing Semiconductor Technology Corp. (300323) FAQ

What is the stock price today?

The current price is ¥11.92.

On which exchange is it traded?

Boeing Semiconductor Technology Corp. is listed on XSHE.

What is its stock symbol?

The ticker symbol is 300323.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.18%.

What is its market cap?

As of today, the market cap is 12.45B.

Has Boeing Semiconductor Technology Corp. ever had a stock split?

Boeing Semiconductor Technology Corp. had 3 splits and the recent split was on Jun 04, 2015.

Boeing Semiconductor Technology Corp. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
Mr. Zhaohong Zhang CEO
XSHE Exchange
CNE100001DV3 ISIN
CN Country
2,836 Employees
19 Jul 2019 Last Dividend
4 Jul 2014 Last Split
1 Jun 2012 IPO Date

Overview

BOE HC SemiTek Corporation, initially known as Wuhan HC SemiTek Co., Ltd and later HC SemiTek Corporation, underwent a name change in May 2024 to its current identity. The company has established itself in the semiconductor industry focusing on the research, development, production, and sales of light emitting diode (LED) epitaxial wafers and chips. From its inception in 2005, it has been actively operating from its base in Wuhan, China, marking its presence in the country's bustling tech sector.

Products and Services

  • Light Emitting Diode (LED) Epitaxial Wafers and Chips

    BOE HC SemiTek specializes in the creation of high-quality LED epitaxial wafers and chips, catering to diverse lighting and display needs. These components are essential for a wide range of applications including but not limited to general lighting, automotive lighting, display panels, and indicators.

  • Sapphire

    The company provides sapphire materials known for their extraordinary hardness and durability. Sapphire materials are crucial in various industrial applications including optical components and high-durability windows.

  • Sapphire Substrate

    BOE HC SemiTek manufactures sapphire substrates that are primarily used as a base for growing epitaxial layers of material. These substrates are essential in the fabrication of LEDs, offering superior thermal, electrical, and optical properties.

  • Sapphire Window Material

    This product pertains to highly durable and transparent sapphire materials crafted specifically for protective window applications. They are utilized in areas where exceptional strength and transparency are critical, such as in optical systems and high-pressure windows.

  • Integrated Circuit and Sensor

    Expanding its semiconductor portfolio, the company also offers solutions in integrated circuits and sensors. These components find applications in a myriad of fields including automotive, consumer electronics, and industrial automation, highlighting the company's versatility in meeting modern technological demands.

Contact Information

Address: No. 8 Binhu Road, Wuhan, China, 430223
Phone: 86 27 8192 9000