Hong Leong Capital Berhad logo

Hong Leong Capital Berhad (5274)

Market Closed
6 Oct, 07:45 AM
XKLS XKLS
RM
3. 25
0
0%
RM
813.46M Market Cap
- P/E Ratio
0.88% Div Yield
191,600 Volume
- Eps
RM 3.25
Previous Close
Add Transaction
Day Range
3.23 3.26
Year Range
3.07 4
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Name Ex-Dividend Date Dividend Payment Date Record Date Declaration Date Frequency
Hong Leong Capital Berhad logo
5274 Announced
Hong Leong Capital Berhad
Pay in 1 week
8 Oct 2026
RM0.18
22 Oct 2026
9 Oct 2026
-
Annual
Hong Leong Capital Berhad logo
5274 Paid
Hong Leong Capital Berhad
28 Oct 2025
10 Oct 2025
RM0.19
28 Oct 2025
13 Oct 2025
-
Annual

5274 Dividend FAQ

What is the dividend yield?

The current dividend yield for 5274 is 0.88%, based on the most recent dividend payment and the current stock price of RM3.25 on the XKLS.

How often are dividends paid?

Dividends are paid on a annual basis, with typical payment being once a year, usually december.

When is the next dividend payment date?

Hong Leong Capital Berhad has not announced any upcoming dividend.

What is the dividend history?

The company has a dividend payment history that includes 0 years of consistent payments. The most recent payment was RM0.18 per share on 2026-10-08. For related earnings insights, visit the 5274 Earnings page.

What is the average annual dividend growth rate?

The average annual dividend growth rate over the past 0 years is approximately 3.72%, reflecting the 5274's commitment to rewarding shareholders.

How can I track 5274 dividends?

You can easily track 5274 dividend payments using our Dividend Tracker. It helps you monitor upcoming payment dates, yields, history, and more - all in one place.