Hirakawa Hewtech Corp. logo

Hirakawa Hewtech Corp. (5821)

Market Closed
10 Aug, 06:00
JPX JPX
¥
3,455. 00
+110
+3.2885%
¥
47.38B Market Cap
- P/E Ratio
48% Div Yield
50,600 Volume
- Eps
¥ 3,345
Previous Close
Add Transaction
Day Range
3,395 3,520
Year Range
1,814 4,710
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Name Ex-Dividend Date Dividend Payment Date Record Date Declaration Date Frequency
Hirakawa Hewtech Corp. logo
5821 Announced
Hirakawa Hewtech Corp.
Pay in 1 month
29 Sep 2026
¥28
29 Sep 2026
30 Sep 2026
-
Semi Annual
Hirakawa Hewtech Corp. logo
5821 Paid
Hirakawa Hewtech Corp.
1 Dec 2025
29 Sep 2025
¥23
1 Dec 2025
30 Sep 2025
-
Semi Annual

5821 Dividend FAQ

What is the dividend yield?

The current dividend yield for 5821 is 48%, based on the most recent dividend payment and the current stock price of ¥3,455.00 on the JPX.

How often are dividends paid?

Dividends are paid on a semi.annual basis, with typical payment being june and december.

When is the next dividend payment date?

The next dividend payment is expected to be on 2026-09-29, Use our Dividend Tracker to monitor 5821 payment history and future distributions.

What is the dividend history?

There is no recent dividend history for Hirakawa Hewtech Corp, as the company has not issued dividends in the past.

What is the average annual dividend growth rate?

There is no dividend growth rate for 5821, as Hirakawa Hewtech Corp has not paid dividends in the past.

How can I track 5821 dividends?

You can easily track 5821 dividend payments using our Dividend Tracker. It helps you monitor upcoming payment dates, yields, history, and more - all in one place.