China Wafer Level CSP Co., Ltd. logo

China Wafer Level CSP Co., Ltd. (603005)

Market Open
11 Aug, 06:57
SSE SSE
¥
32. 73
-0.29
-0.8783%
¥
21.95B Market Cap
- P/E Ratio
0.18% Div Yield
7.65M Volume
- Eps
¥ 33.02
Previous Close
Add Transaction
Day Range
32.51 33.33
Year Range
25.92 55.26
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Name Ex-Dividend Date Dividend Payment Date Record Date Declaration Date Frequency
China Wafer Level CSP Co., Ltd. logo
603005 Paid
China Wafer Level CSP Co., Ltd.
18 May 2026
18 May 2026
¥0.12
18 May 2026
15 May 2026
-
Annual
China Wafer Level CSP Co., Ltd. logo
603005 Paid
China Wafer Level CSP Co., Ltd.
4 Jul 2025
4 Jul 2025
¥0.08
4 Jul 2025
3 Jul 2025
-
Annual

603005 Dividend FAQ

What is the dividend yield?

The current dividend yield for 603005 is 0.18%, based on the most recent dividend payment and the current stock price of ¥32.73 on the SSE.

How often are dividends paid?

Dividends are paid on a annual basis, with typical payment being once a year, usually december.

When is the next dividend payment date?

China Wafer Level CSP Co., Ltd has not announced any upcoming dividend.

What is the dividend history?

The company has a dividend payment history that includes 0 years of consistent payments. The most recent payment was ¥0.12 per share on 2026-05-18. For related earnings insights, visit the 603005 Earnings page.

What is the average annual dividend growth rate?

The average annual dividend growth rate over the past 0 years is approximately 6.59%, reflecting the 603005's commitment to rewarding shareholders.

How can I track 603005 dividends?

You can easily track 603005 dividend payments using our Dividend Tracker. It helps you monitor upcoming payment dates, yields, history, and more - all in one place.