Acm Research (Shanghai) Inc. (688082)

Overview

ACM Research (Shanghai), Inc. specializes in the research, development, manufacture, and sale of semiconductor equipment, serving clients both in China and internationally. Established in 2005 and headquartered in Shanghai, China, the company has carved a niche for itself in the semiconductor industry. ACM Research (Shanghai), Inc. operates as a vital subsidiary of ACM Research, Inc., leveraging its innovative solutions to meet the growing demands of the semiconductor production sector. Its product portfolio spans various categories crucial for semiconductor processing, including cleaning, scrubbing, and polishing, among others, highlighting its commitment to advancing semiconductor technology and production efficiency.

Products and Services

ACM Research (Shanghai), Inc. offers a comprehensive range of equipment utilized in semiconductor production, as follows:

• Cleaning Equipment - This includes machinery designed for the thorough cleaning of semiconductor wafers to remove particles and impurities, thereby ensuring high-quality substrate surfaces for further processing.
• Scrubbing Equipment - Equipment focused on the mechanical scrubbing of wafers to eliminate contaminants and residues, complementing the cleaning processes to enhance the purity and quality of the semiconductor surfaces.
• Polishing Equipment - These systems are used for chemical-mechanical planarization (CMP), a critical step in smoothing surfaces and ensuring uniform thickness on semiconductor wafers, vital for the next phases of semiconductor fabrication.
• Vertical Furnace Tube Equipment - Machinery used for thermal processing, including oxidation, diffusion, and annealing, which are essential processes for altering the electrical properties of semiconductor materials.
• Front-end Coating and Development Equipment - This category includes tools for the application of photoresist and other coatings essential for lithography, as well as the development processes that prepare wafers for etching and other fabrication steps.
• Electroplating Equipment - Equipment designed for the electroplating process, crucial for the deposition of metal layers onto semiconductor wafers, playing a key role in the creation of circuits and components.
• Single Wafer and Tank Wet Cleaning Equipment - These are specialized systems for wet cleaning processes, targeting the removal of contaminants from individual wafers or batches, using chemical baths or rinses to ensure optimal cleanliness.
• PECVD (Plasma-Enhanced Chemical Vapor Deposition) Equipment - Tools for depositing thin films over wafers through a plasma-enhanced vapor deposition process, critical for creating insulating layers and other semiconductor components.
• Gluing Equipment - Machinery used in the process of bonding semiconductor wafers and other components, essential for the assembly and integrity of multi-layer or complex semiconductor devices.
• Wet Etching and Degumming Equipment - This includes tools for wet etching, a process that removes material from the wafer surface using liquid chemicals, and degumming, aimed at cleaning and preparing surfaces for further processing or packaging.