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Aehr Test Systems, Inc. (AEHR) Q1 2026 Earnings Call Transcript
Aehr Test Systems, Inc. (NASDAQ:AEHR ) Q1 2026 Earnings Call October 6, 2025 5:00 PM EDT Company Participants Gayn Erickson - President, CEO & Director Chris Siu - CFO, Executive VP of Finance & Secretary Conference Call Participants Jim Byers - PondelWilkinson Inc. Christian Schwab - Craig-Hallum Capital Group LLC, Research Division Mark Shooter - William Blair & Company L.L.C., Research Division Bradford Ferguson - Halter Ferguson Financial, Inc. Larry Chlebina - Chlebina Capital Management, LLC Presentation Operator Greetings.
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Aehr Test Systems: Follow-On Orders Validate The Bullish Thesis
Aehr Test Systems, Inc.'s latest follow-on orders from its leading AI hyperscaler customer for Sonoma systems represent a significant validation to its technology. AEHR appears to be a key pillar to its hyperscaler customer's long-term plans due to the large-scale deployment of its Sonoma systems. AEHR's consumable BIM sales are likely to grow significantly as the hyperscaler customer intends to ramp production of their own AI processors and introduce new chip designs in CY 2026.
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Aehr Test Systems Profile
| - Industry | - Sector | Gayn Erickson CEO | NASDAQ (CM) Exchange | 00760J108 CUSIP |
| US Country | 115 Employees | - Last Dividend | - Last Split | 14 Aug 1997 IPO Date |
Overview
Aehr Test Systems specializes in delivering innovative testing solutions tailored for the semiconductor industry at various stages, including wafer level, singulated die, and packaged parts. With a global installation footprint, the company equips semiconductor manufacturers with the necessary systems to execute comprehensive test and burn-in processes, aiming at ensuring device reliability and performance. Since its inception in 1977, Aehr Test Systems has established its headquarters in Fremont, California, reflecting its longstanding commitment to advancing semiconductor test technology.
Products and Services
- FOX-XP and FOX-NP Systems
These systems represent Aehr's forefront in addressing the full wafer contact and singulated die/module test and burn-in requirements. Designed to accommodate a wide variety of devices - from silicon carbide-based power semiconductors to advanced 2D and 3D sensors used in mobile technologies, as well as memory, processors, microcontrollers, systems-on-a-chip (SoC), and even photonics and integrated optical devices. The versatility of FOX-XP and FOX-NP systems ensures comprehensive testing and stabilization across a broad spectrum of semiconductor components.
- FOX-CP System
As a cost-effective solution for logic, memory, and photonic device testing, the FOX-CP system underscores Aehr Test Systems' commitment to delivering single-wafer compact test solutions. Its design caters specifically to the testing needs of logic, memory, and photonic devices, aligning with the industry’s demand for less expensive, yet efficient, testing methods.
- FOX WaferPak Contactor
This innovative full wafer contactor is capable of testing wafers up to 300mm, enabling a seamless and effective test, burn-in, and stabilization process for full wafers. The FOX WaferPak Contactor exemplifies Aehr Test Systems' expertise in creating solutions that facilitate integrated circuit manufacturers' ability to maintain quality and reliability in their products.
- FOX DiePak Carrier and Loader
The FOX DiePak Carrier introduces a reusable temporary packaging solution designed to enable the final test and burn-in of bare die and modules, emphasizing Aehr's focus on sustainability and efficiency. Accompanying the carrier, the FOX DiePak Loader further streamlines the semiconductor manufacturing and testing process, ensuring that IC manufacturers can achieve optimal testing accuracy and device reliability.
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