BE Semiconductor Industries N.V. logo

BE Semiconductor Industries N.V. (BESIY)

Market Closed
18 Jun, 20:00
OTC PINK OTC PINK
$
365. 70
+12.78
+3.6212%
$
28.97B Market Cap
- P/E Ratio
8.6% Div Yield
489 Volume
- Eps
$ 352.92
Previous Close
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Day Range
359 366
Year Range
122.81 368.93
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Summary

BESIY closed today higher at $365.7, an increase of 3.6212% from yesterday's close, completing a monthly increase of 24.9231% or $72.96. Over the past 12 months, BESIY stock gained 110.766%.
BESIY pays dividends to its shareholders, with the most recent payment made on May 14, 2026. The next estimated payment will be in In 10 months on May 14, 2027 for a total of $1.84765.
The last earnings report, released on Apr 23, 2026, missed the consensus estimates by -0.6141%. On average, the company has fell short of earnings expectations by -0.2099%, based on the last three reports.
BE Semiconductor Industries N.V. has completed 1 stock splits, with the recent split occurring on May 10, 2018.
The company's stock is traded on 4 different exchanges and in various currencies, with the primary listing on OTC PINK (USD).

BESIY Chart

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BE Semiconductor Industries N.V. (BESIY) Analyst/Investor Day Transcript

BE Semiconductor Industries N.V. (BESIY) Analyst/Investor Day Transcript

BE Semiconductor Industries N.V. (BESIY) Analyst/Investor Day Transcript

Seekingalpha | 1 hour ago
BE Semiconductor Raises Long-Term Revenue, Profitability Targets on AI Boost

BE Semiconductor Raises Long-Term Revenue, Profitability Targets on AI Boost

BE Semiconductor Industries raised its long-term revenue and profitability targets, citing increased demand for AI-related products.

Wsj | 16 hours ago
BE Semiconductor: The AI Packaging Bottleneck Play Investors Overlook

BE Semiconductor: The AI Packaging Bottleneck Play Investors Overlook

BE Semiconductor remains a Buy, with 35% upside and a $301.48 price target despite premium valuation and near-term hybrid bonding uncertainty. Q4 revenue rose 25.4% sequentially and 8.5% YoY, driven by strong 2.5D packaging and photonics demand, while orders surged 43.3% sequentially. BESIY's book-to-bill ratio consistently above 1 signals robust 2026 demand, with hybrid bonding positioning the company as a technology front-runner.

Seekingalpha | 2 months ago

BE Semiconductor Industries N.V. (BESIY) FAQ

What is the stock price today?

The current price is $365.70.

On which exchange is it traded?

BE Semiconductor Industries N.V. is listed on OTC PINK.

What is its stock symbol?

The ticker symbol is BESIY.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 8.6%.

What is its market cap?

As of today, the market cap is 28.97B.

Has BE Semiconductor Industries N.V. ever had a stock split?

BE Semiconductor Industries N.V. had 1 splits and the recent split was on May 10, 2018.

BE Semiconductor Industries N.V. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
Richard W. Blickman CEO
OTC PINK Exchange
073320103 CUSIP
NL Country
1,820 Employees
28 Apr 2026 Last Dividend
10 May 2018 Last Split
- IPO Date

Overview

BE Semiconductor Industries N.V., often abbreviated as BE Semiconductor or BESI, is a leading entity in the semiconductor assembly equipment sector, catering to both the semiconductor and electronics industries globally. Its operations are widespread, involving significant markets such as China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, various other Asia Pacific locations, and Europe. Founded in 1995 and based in Duiven, the Netherlands, BESI has established itself through its innovative approach in the development, manufacturing, marketing, sale, and service of semiconductor assembly tools. The company’s business activities are organized into three primary segments: Die Attach, Packaging, and Plating, addressing the comprehensive needs of multinational chip manufacturers, assembly subcontractors, and a broad spectrum of companies within the electronics and industrial domains.

Products and Services

  • Die Attach Equipment

    This category includes a range of sophisticated machinery designed for various assembly processes such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems. These tools are critical for ensuring precise component placement and reliable interconnections in semiconductor devices.

  • Packaging Equipment

    BESI provides advanced packaging solutions encompassing conventional, ultra-thin, and wafer level molding machines, in addition to trim and form, and singulation systems. These systems are vital for the encapsulation and protection of semiconductor chips, addressing the needs for miniaturization and enhanced performance of electronic devices.

  • Plating Equipment

    The plating equipment portfolio includes systems for tin, copper, precious metal, and solar plating, complemented by a selection of related process chemicals. These solutions are integral to the fabrication of semiconductor devices, offering critical functionalities such as the formation of conductive pathways and enhancing the durability of components.

  • Tooling, Conversion Kits, Spare Parts, and Services

    Beyond its main products, BESI provides an extensive range of supporting services and products, including tooling, conversion kits for equipment upgrades or modifications, and a broad assortment of spare parts. The company also offers comprehensive services to ensure the optimal performance and longevity of its equipment, enhancing customer satisfaction and operational efficiency.

Contact Information

Address: Ratio 6
Phone: 31 26 319 4500