Chipbond Technology Corporation (6147)
Market Closed
11 Aug, 05:30
TWSE 
JPX Primary TWSE NT$
161. 50
+7.5
+4.8701%
NT$
- Market Cap
- P/E Ratio
40% Div Yield
31.77M Volume
- Eps
NT$ 154
Previous Close Want to track 6147 and more in your Portfolio? 🎯
Sign up for Marketlog, a portfolio tracker that will exceed your expectations!
| Name | Ex-Dividend Date | Dividend | Payment Date | Record Date | Declaration Date | Frequency |
|---|---|---|---|---|---|---|
| | 17 Jun 2026 | NT$2.8 | 15 Jul 2026 | 18 Jun 2026 | - | Annual |
6147 Dividend FAQ
What is the dividend yield?
The current dividend yield for 6147 is 40%, based on the most recent dividend payment and the current stock price of NT$161.50 on the TWSE.
How often are dividends paid?
Dividends are paid on a annual basis, with typical payment being once a year, usually december.
When is the next dividend payment date?
Chipbond Technology Corporation has not announced any upcoming dividend.
What is the dividend history?
There is no recent dividend history for Chipbond Technology Corporation, as the company has not issued dividends in the past.
What is the average annual dividend growth rate?
There is no dividend growth rate for 6147, as Chipbond Technology Corporation has not paid dividends in the past.
How can I track 6147 dividends?
You can easily track 6147 dividend payments using our Dividend Tracker. It helps you monitor upcoming payment dates, yields, history, and more - all in one place.
