Chipbond Technology Corporation logo

Chipbond Technology Corporation (6147)

Market Closed
11 Aug, 05:30
TWSE TWSE
NT$
161. 50
+7.5
+4.8701%
NT$
- Market Cap
- P/E Ratio
40% Div Yield
31.77M Volume
- Eps
NT$ 154
Previous Close
Add Transaction
Day Range
146.5 166
Year Range
50.2 313.5
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Name Exchange Split Ratio
Chipbond Technology Corporation logo
6147 Chipbond Technology Corporation
5 Aug 2008
TWSE
102:100
Chipbond Technology Corporation logo
6147 Chipbond Technology Corporation
7 Aug 2007
TWSE
51:50
Chipbond Technology Corporation logo
6147 Chipbond Technology Corporation
8 Aug 2006
TWSE
261:250

6147 Stock Split FAQ

When was the last stock split?

The last stock split occurred on 2008-08-05, with a 102.0 to 100.0 split ratio, based on the 6147's announcement.

What was the stock exchange for the split?

The most recent stock split took place on the TWSE exchange.